The MEMS and Nanotechnology Exchange coordinates a virtual fab, a network of fabrication centers that lets our users draft process sequences which are performed across the boundaries separating the individual facilities. Our service is made available to the United States community including commercial, academic, and government organizations.

The MEMS and Nanotechnology Exchange provides general consulting as well as invention creative services to the community. General consulting includes such activities as:

• Development of a product development strategy
• Costing analysis for NRE as well as manufacturing
• Optimization of device design and/or fabrication
• Evaluation of production efficiencies
• Selecting suitable foundries for manufacturing
• Assisting in transfer of production to another foundry
• Device and/or process diagnostics
• Development or evaluation of a QC protocol
• Reliability and failure analysis
• Mechanical or material property measurement and characterization

The MEMS and Nanotechnology Exchange offers a range of options for mask design and fabrication. Our engineers can make the layout design for you or use your layout files. Our mask fabrication capabilities range from pattern generation, to E-beam, to X-ray.

Whatever your mask requirements are, the MEMS and Nanotechnology Exchange can help.

The MEMS Exchange has developed a software system that is specially suited for MEMS and Nano technology job shops. The software system has many of the same features as the software that runs the entire MEMS Exchange operation and is well suited for managing a project or an entire facility's operations depending on the exact needs of the customer.

The system incorporates over 30 man-years of development effort and runs in a Linux environment. Our software system uses a network-based approach and therefore affords easier access, provides excellent scalability, eliminates problems with compatibility, but affords high-level security protections.

Contact us at engineering@mems-exchange.org

Advanced MEMS for RF and MillimeterWave Communications

This Network of Excellence aims to create a European Virtual Institute for developing Smart MEMS microsystems for advanced communications. It regroups 25 partners from 14 countries.

ACES is a first PC-based 3-D etch simulator. The program can simulate silicon etching with different front-surface orientations in different etchants.

It is developed by the Micro Actuators, Sensors and Systems Group (MASS) http://galaxy.micro.uiuc.edu

The Center of Compound Semiconductor Microelectronics
University of Illinois at Urbana-Champaign

ANSYS software has evolved into a multi-physics analysis environment capable of simulating a broad range of physics including: structural, thermal, fluid , acoustics, electromagnetics, and electronic circuits. The ANSYS/Multiphysics product supports direct and indirect coupling between these different physics to facilitate accurate modeling of real world effects. Examples relevant to the MEMS community are fluid-structural, thermo-electric (Joule heating), electro-structural (piezoelectric) and electrostatic-structural.

The ANSYS/MEMS Website http://www.ansys.com/ansys/ provides an overview of the ANSYS MEMS Initiative, and also recent technical papers showing ANSYS in action, ANSYS Solutions articles containing some serious MEMS analysis, and a basic MEMS materials database.

ANSYS.NET http://ansys.net/ansys/ an ansys user's resource, is an extensive collection of ANSYS-related resources.

The XANSYS mailing list http://www.xansys.org/ is for discussion among ANSYS users about program bugs/ideas/modelling techniques, hardware, FEA employment, and related topics.

• MEMS & ASIC design - Including layout, full ANSYS multiphysics, and advanced analytic capabilities
• Fabrication - PhD handled development through prototype and pilot production through allied fabs
• Intellectual Property Management - established sales relationships and free to selling party
• Due Diligence - Experienced consultants for VC, acquisition, and public company analysis
• ITAR capable - We can handle ITAR throughout our process if requested, including fabrication

ASM International is the society for materials engineers and scientists, a worldwide network dedicated to advancing industry, technology, and applications of metals and materials.

The MEMS Materials Database is a comprehensive and authoritative new source for the mechanical, physical and chemical properties of materials appropriate to the range of MEMS Packaging challenges facing device designers.

Used & Refurbished Semiconductor and Mems Manufacturing Equipment. Our Specialty is Metrology & Deposition systems. Complete Facility Acquisitions and Sales.

We also provide High-Tech Equipment Appraisals, from single items to complete facilites for asset based loans.

Materials for Electron Beam Lithography, LIGA, NIL (Nano-Imprint Lithography) and photosensitive polyimide applications.

Performance layers offered provide release/lift-off capability, planarization, optical properties or additional physical characteristics.

Protective coatings offered include contact products, chemical products and electrical passivation products.

Stephen C. Minne, Scott R. Manalis, Calvin F. Quate/Hardcover/Published 1999. Bringing Scanning Probe Microscopy Up to Speed introduces the principles of scanning probe systems with particular emphasis on techniques for increasing speed. The authors include useful information on the characteristics and limitations of current state-of-the-art machines as well as the properties of the systems that will follow in the future. The basic approach is two-fold. First, fast scanning systems for single probes are treated and, second, systems with multiple probes operating in parallel are presented.

The key components of the SPM are the mechanical microcantilever with integrated tip and the systems used to measure its deflection. In essence, the entire apparatus is devoted to moving the tip over a surface with a well-controlled force. The mechanical response of the actuator that governs the force is of the utmost importance since it determines the scanning speed. The mechanical response relates directly to the size of the actuator; smaller is faster. Traditional scanning probe microscopes rely on piezoelectric tubes of centimeter size to move the probe. In future scanning probe systems, the large actuators will be replaced with cantilevers where the actuators are integrated on the beam. These will be combined in arrays of multiple cantilevers with MEMS as the key technology for the fabrication process.

• Applied research work
• Product development
• Prototype and low-volume production.

Comprehensive Microsystems, is a new 3-volume reference work on Microelectromechanical Systems (MEMS). MEMS are micron-sized devices that sense or manipulate a physical environment. They are used in a wide range of industrial products, from high-tech instrumentation to disposable consumer items, including airbag sensors in automobiles, laser jet printer heads and blood pressure monitors.

Given their increased use, MEMS research is continually evolving, generating the need for an all-inclusive, up-to date reference on these devices. Comprehensive Microsystems will fill this gap by facilitating access to established research by both academics and professionals in the field. This work is designed to be both an essential reference tool for those entering the field as well as a useful handbook for MEMS researchers in industry and academia.

Manufactures vacuum wands, manual wands (wafer tweezers), vacuum pumps, tubing, and other wafer handling tools. ESD safe products and tweezers for 300mm wafer handling are also available.

Their Advanced Vacuum Technology http://www.vacuumwand.com/ division also manufactures die handling tools.

Glocap Search (www.glocapsearch.com) Premier search firm serviing private equity, hedge funds, investment bands, consulting and industry clients.

Glocap Partners (www.glocappartners.com) Boutiquie investment banking firm assisting companies in raising private equity, PIPEs and mezzanine capital, advising on mergers & acquisitions, JVs, recaps/restructurings, and providing fairness opinions.

Glocap Advisors (www.glocapadvisors.com) Privately-held financial services firm focused on the placement of funds and the development of alternative investment products for the instutional investor.

• ABAQUS/Standard http://www.hks.com/products/p_abstandard.html is a general purpose finite element program designed specifically for advanced structural and heat transfer analysis.
• ABAQUS/Explicit http://www.hks.com/products/p_abexplicit.html is a finite element program designed specifically to serve advanced, nonlinear continuum and structural analysis needs.

Hussein Ballan, Michel Declercq/Hardcover/Published 1998. Standard voltages used in today's ICs may vary from about 1.3V to more than 100V, depending on the technology and the application. High voltage is therefore a relative notion.

High Voltage Devices and Circuits in Standard CMOS Technologies is mainly focused on standard CMOS technologies, where high voltage (HV) is defined as any voltage higher than the nominal (low) voltage, i.e. 5V, 3.3V, or even lower. In this standard CMOS environment, IC designers are more and more frequently confronted with HV problems, particularly at the I/O level of the circuit.

In the first group of applications, a large range of industrial or consumer circuits either require HV driving capabilities, or are supposed to work in a high-voltage environment. This includes ultrasonic drivers, flat panel displays, robotics, automotive, etc. On the other hand, in the emerging field of integrated microsystems, MEMS actuators mainly make use of electrostatic forces involving voltages in the typical range of 30 to 60V. Last but not least, with the advent of deep sub-micron and/or low-power technologies, the operating voltage tends towards levels ranging from 1V to 2.5V, while the interface needs to be compatible with higher voltages, such as 5V.

For all these categories of applications, it is usually preferable to perform most of the signal processing at low voltage, while the resulting output rises to a higher voltage level. Solving this problem requires some special actions at three levels: technology, circuit design and layout.

High Voltage Devices and Circuits in Standard CMOS Technologies addresses these topics in a clear and organized way. The theoretical background is supported by practical information and design examples. It is an invaluable reference for researchers and professionals in both the design and device communities.

Saint-Gobain Grains & Powders - Surface Conditioning Group

Leader in the development and manufacture of high purity chemicals and abrasives for the surface perfection of metals, ceramics, glasses and crystals. Engineered abrasive particles and biodegradable chemistries for critical surface finishing of MEMS and nanotechnology devices.

Kleindiek Nanotechnik is a young, customer oriented high-tech company. With an innovative and powerful driving concept we are entering new space in micro- and nano-positioning.

Due to miniaturisation in semiconductor technology, optics, micro-mechanics, medicine, gene- and bio-technology, highly precise positioning techniques are becoming increasingly important. Our products meet and exceed customer's requirements, offering them a new level of precision.

MEMS Investor Journal was founded in 2003, currently has 2500+ subscribers and is the only independent publication devoted to providing MEMS professionals with the latest developments in the rapidly growing MEMS industry.

MEMS Investor Journal publishes a free weekly newsletter that is specifically designed for professionals working in the areas of MEMS, sensors and microsystems and features top MEMS stories from 7000+ sources worldwide, interviews with MEMS industry leaders as well as coverage of the latest MEMS related patents and patent applications.

Bartlomiej F. Romanowicz/Hardcover/Published 1998. Over the past two decades, technologies for microsystems fabrication have made considerable progress. This has made possible a large variety of new commercial devices ranging, for example, from integrated pressure and acceleration microsensors to active micromirror arrays for image projection. In the near future, there will be a number of new devices, which will be commercialized in many application areas.

The field of microsystems is characterized by its wide diversity, which requires a multidisciplinary approach for design and processes as well as in application areas. Although there is a common technological background derived from integrated circuits, it is clear that microsystems will require additional application-specific technologies. Since most microsystem technologies are based on batch processing and dedicated to mass production, prototyping is likely to be an expensive and time-consuming step. It is recognized that standardization of the processes as well as of the design tools will definitely help reduce the entry cost of microsystems. This creates a very challenging situation for the design, modeling and simulation of microsystems.

Methodology for the Modeling and Simulation of Microsystems is the first book to give an overview of the problems associated with modeling and simulation of microsystems. It introduces a new methodology, which is supported by several examples. It should provide a useful starting point for both scientists and engineers seeking background information for efficient design of microsystems.

Benjamin W. Chui/Hardcover/Published 1998. Microcantilevers for Atomic Force Microscope Data Storage describes a research collaboration between IBM Almaden and Stanford University in which a new mass data storage technology was evaluated. This technology is based on the use of heated cantilevers to form submicron indentations on a polycarbonate surface, and piezoresistive cantilevers to read those indentations.

Microcantilevers for Atomic Force Microscope Data Storage describes how silicon micromachined cantilevers can be used for high-density topographic data storage on a simple substrate such as polycarbonate. The cantilevers can be made to incorporate resistive heaters (for thermal writing) or piezoresistive deflection sensors (for data readback).

The primary audience for Microcantilevers for Atomic Force Microscope Data Storage is industrial and academic workers in the microelectromechanical systems (MEMS) area. It will also be of interest to researchers in the data storage industry who are investigating future storage technologies.

Mark R. Hornung and Oliver Brand/Hardcover/Published 1999. Micromachined Ultrasound-Based Proximity Sensors presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. It describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems.

Micromachined Ultrasound-Based Proximity Sensors describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity.

Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences. The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements.

The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm.

Micromachined Ultrasound-Based Proximity Sensors will be of interest to MEMS researchers as well as those involved in solid-state sensor development.

Innovative x-ray components and optical polarizers x-ray products and optical polarizers

MOXTEK®, Inc. was founded in 1986 with technology jointly developed with Brigham Young University. Today, MOXTEK is a leader in the development and manufacturing of X-ray and optical components. Moxtek is well known for advanced technology, innovative solutions, and excellent customer service.

From automated teller machines and atomic clocks to mammograms and semiconductors, innumerable products and services rely in some way on technology, measurement, and standards provided by the National Institute of Standards and Technology.

Founded in 1901, NIST is a non-regulatory federal agency within the U.S. Commerce Department's Technology Administration. NIST's mission is to promote U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life.

• Symposia on MEMS business and commercialization issues,
• MEMS training and awareness programs, and
• Technology cluster hosting for MEMS entrepreneurs.

PELCHEM, the chemical division of Necsa, is focused on manufacturing and marketing a wide variety of high quality, advanced fluorochemicals and value added downstream products for the global fluorochemical industry.

We offer stock holding on our site for all our contracted customers. We support the principles and practices of safe handling of Fluoride Chemicals, from both the USA and European Technical Committees.

Profma produces and supplies polyimide film equivalent to Kapton HN,VN,FN, and has developed FN616 equivalent for market. See: http://www.profma.com/polyimide.htm

Profma has the only Chinese factory producing large NiZn ferrite magnets for research institutes or universities; particle, neutron and electron accelerators, also used in high pulse electricity systems. See: http://www.profma.com/baseterms.htm

SAMLAB, standing for the Sensors, Actuators and Microsystems Laboratory, is part of the Institute of Microtechnology (IMT) of the University of Neuchâtel. SAMLAB is located on the premises of the technological center at Rue Jaquet-Droz 1, together with the "Centre Suisse d'Electronique et de Microtechique SA" (CSEM), as well as the newly established incubator NEODE.

SAMLAB has well-established expertise in micro- and nanotechnology. Multi-disciplinary research activities have encompassed many diverse applications from the life sciences to telecommunications. Microfabricated probes for atomic force and near field optical microscopy, micromechanical devices for optical fibre networks, discrete microsensors and miniaturised chemical analysis systems for environmental and clinical analyses, and micro-instrumentation for space research are examples of SAMLAB current research activities.