Stephen C. Minne, Scott R. Manalis, Calvin F. Quate/Hardcover/Published 1999. Bringing Scanning Probe Microscopy Up to Speed introduces the principles of scanning probe systems with particular emphasis on techniques for increasing speed. The authors include useful information on the characteristics and limitations of current state-of-the-art machines as well as the properties of the systems that will follow in the future. The basic approach is two-fold. First, fast scanning systems for single probes are treated and, second, systems with multiple probes operating in parallel are presented.

The key components of the SPM are the mechanical microcantilever with integrated tip and the systems used to measure its deflection. In essence, the entire apparatus is devoted to moving the tip over a surface with a well-controlled force. The mechanical response of the actuator that governs the force is of the utmost importance since it determines the scanning speed. The mechanical response relates directly to the size of the actuator; smaller is faster. Traditional scanning probe microscopes rely on piezoelectric tubes of centimeter size to move the probe. In future scanning probe systems, the large actuators will be replaced with cantilevers where the actuators are integrated on the beam. These will be combined in arrays of multiple cantilevers with MEMS as the key technology for the fabrication process.

Comprehensive Microsystems, is a new 3-volume reference work on Microelectromechanical Systems (MEMS). MEMS are micron-sized devices that sense or manipulate a physical environment. They are used in a wide range of industrial products, from high-tech instrumentation to disposable consumer items, including airbag sensors in automobiles, laser jet printer heads and blood pressure monitors.

Given their increased use, MEMS research is continually evolving, generating the need for an all-inclusive, up-to date reference on these devices. Comprehensive Microsystems will fill this gap by facilitating access to established research by both academics and professionals in the field. This work is designed to be both an essential reference tool for those entering the field as well as a useful handbook for MEMS researchers in industry and academia.

Hussein Ballan, Michel Declercq/Hardcover/Published 1998. Standard voltages used in today's ICs may vary from about 1.3V to more than 100V, depending on the technology and the application. High voltage is therefore a relative notion.

High Voltage Devices and Circuits in Standard CMOS Technologies is mainly focused on standard CMOS technologies, where high voltage (HV) is defined as any voltage higher than the nominal (low) voltage, i.e. 5V, 3.3V, or even lower. In this standard CMOS environment, IC designers are more and more frequently confronted with HV problems, particularly at the I/O level of the circuit.

In the first group of applications, a large range of industrial or consumer circuits either require HV driving capabilities, or are supposed to work in a high-voltage environment. This includes ultrasonic drivers, flat panel displays, robotics, automotive, etc. On the other hand, in the emerging field of integrated microsystems, MEMS actuators mainly make use of electrostatic forces involving voltages in the typical range of 30 to 60V. Last but not least, with the advent of deep sub-micron and/or low-power technologies, the operating voltage tends towards levels ranging from 1V to 2.5V, while the interface needs to be compatible with higher voltages, such as 5V.

For all these categories of applications, it is usually preferable to perform most of the signal processing at low voltage, while the resulting output rises to a higher voltage level. Solving this problem requires some special actions at three levels: technology, circuit design and layout.

High Voltage Devices and Circuits in Standard CMOS Technologies addresses these topics in a clear and organized way. The theoretical background is supported by practical information and design examples. It is an invaluable reference for researchers and professionals in both the design and device communities.

Bartlomiej F. Romanowicz/Hardcover/Published 1998. Over the past two decades, technologies for microsystems fabrication have made considerable progress. This has made possible a large variety of new commercial devices ranging, for example, from integrated pressure and acceleration microsensors to active micromirror arrays for image projection. In the near future, there will be a number of new devices, which will be commercialized in many application areas.

The field of microsystems is characterized by its wide diversity, which requires a multidisciplinary approach for design and processes as well as in application areas. Although there is a common technological background derived from integrated circuits, it is clear that microsystems will require additional application-specific technologies. Since most microsystem technologies are based on batch processing and dedicated to mass production, prototyping is likely to be an expensive and time-consuming step. It is recognized that standardization of the processes as well as of the design tools will definitely help reduce the entry cost of microsystems. This creates a very challenging situation for the design, modeling and simulation of microsystems.

Methodology for the Modeling and Simulation of Microsystems is the first book to give an overview of the problems associated with modeling and simulation of microsystems. It introduces a new methodology, which is supported by several examples. It should provide a useful starting point for both scientists and engineers seeking background information for efficient design of microsystems.

Benjamin W. Chui/Hardcover/Published 1998. Microcantilevers for Atomic Force Microscope Data Storage describes a research collaboration between IBM Almaden and Stanford University in which a new mass data storage technology was evaluated. This technology is based on the use of heated cantilevers to form submicron indentations on a polycarbonate surface, and piezoresistive cantilevers to read those indentations.

Microcantilevers for Atomic Force Microscope Data Storage describes how silicon micromachined cantilevers can be used for high-density topographic data storage on a simple substrate such as polycarbonate. The cantilevers can be made to incorporate resistive heaters (for thermal writing) or piezoresistive deflection sensors (for data readback).

The primary audience for Microcantilevers for Atomic Force Microscope Data Storage is industrial and academic workers in the microelectromechanical systems (MEMS) area. It will also be of interest to researchers in the data storage industry who are investigating future storage technologies.

Mark R. Hornung and Oliver Brand/Hardcover/Published 1999. Micromachined Ultrasound-Based Proximity Sensors presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. It describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems.

Micromachined Ultrasound-Based Proximity Sensors describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity.

Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences. The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements.

The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm.

Micromachined Ultrasound-Based Proximity Sensors will be of interest to MEMS researchers as well as those involved in solid-state sensor development.