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Material: Copper (Cu), bulk

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Property↑↓Value↑↓Conditions↑↓Reference↑↓
Poisson's Ratio0.36Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties.Mechanics of Materials 23(1996), p.314
Specific heat384.56 J/kg/KAt Temp=25 C.CRC Materials Science and Engineering Handbook, p.260
Thermal conductivity398 W/m/KValue at temp=300 K.CRC Materials Science and Engineering Handbook, p.270-274
Yield strength100 MPaVias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties.Mechanics of Materials 23(1996), p.314
Young's Modulus128 GPaVias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties.Mechanics of Materials 23(1996), p.314
density8960 kg/m^325 degrees CHandbook of the elements, S. Ruben, 2 nd printing (1987), Open Court Publishing
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