Material: Copper (Cu), film

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Property↑↓	Value↑↓	Conditions↑↓	Reference↑↓
Strain,at max.load	0.01	Pure copper electron-beam evaporated on a cooled (room temperature) substrate. Thickness is 1.72 micrometers. Film is actually a trilayer with Ti "barrier" layers on both sides.	"Mechanical Behavior of Aluminum and Copper Thin Films," by David T. Read and James W. Dally, in Mechanics and Materials for Electronic Packaging: Volume 2, Thermal and Mechanical Behavior and Modeling, edited by M. Schen, H. Abe, and E. Suhir, American Society of Mechanical Engineers, AMD-Vol,1994, p.41-49
Ultimate strength	310 MPa	Pure copper electron-beam evaporated on a cooled (room temperature) substrate. Thickness is 1.72 micrometers. Film is actually a trilayer with Ti "barrier" layers on both sides.	"Mechanical Behavior of Aluminum and Copper Thin Films," by David T. Read and James W. Dally, in Mechanics and Materials for Electronic Packaging: Volume 2, Thermal and Mechanical Behavior and Modeling, edited by M. Schen, H. Abe, and E. Suhir, American Society of Mechanical Engineers, AMD-Vol,1994, p.41-49
Yield strength	262 MPa	Pure copper electron-beam evaporated on a cooled (room temperature) substrate. Thickness is 1.72 micrometers. Film is actually a trilayer with Ti "barrier" layers on both sides.	"Mechanical Behavior of Aluminum and Copper Thin Films," by David T. Read and James W. Dally, in Mechanics and Materials for Electronic Packaging: Volume 2, Thermal and Mechanical Behavior and Modeling, edited by M. Schen, H. Abe, and E. Suhir, American Society of Mechanical Engineers, AMD-Vol,1994, p.41-49