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To purchase MEMS-related materials, supplies, equipment, wafers, etc.,
please visit the links section of the MEMSNet site.
| Property | Value | Conditions | Reference |
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| Strain,at max.load | 0.01 | Pure copper electron-beam evaporated on a cooled (room temperature) substrate. Thickness is 1.72 micrometers. Film is actually a trilayer with Ti "barrier" layers on both sides. | "Mechanical Behavior of Aluminum and Copper Thin Films," by David T. Read and James W. Dally, in Mechanics and Materials for Electronic Packaging: Volume 2, Thermal and Mechanical Behavior and Modeling, edited by M. Schen, H. Abe, and E. Suhir, American Society of Mechanical Engineers, AMD-Vol,1994, p.41-49 | | Ultimate strength | 310 MPa | Pure copper electron-beam evaporated on a cooled (room temperature) substrate. Thickness is 1.72 micrometers. Film is actually a trilayer with Ti "barrier" layers on both sides. | "Mechanical Behavior of Aluminum and Copper Thin Films," by David T. Read and James W. Dally, in Mechanics and Materials for Electronic Packaging: Volume 2, Thermal and Mechanical Behavior and Modeling, edited by M. Schen, H. Abe, and E. Suhir, American Society of Mechanical Engineers, AMD-Vol,1994, p.41-49 | | Yield strength | 262 MPa | Pure copper electron-beam evaporated on a cooled (room temperature) substrate. Thickness is 1.72 micrometers. Film is actually a trilayer with Ti "barrier" layers on both sides. | "Mechanical Behavior of Aluminum and Copper Thin Films," by David T. Read and James W. Dally, in Mechanics and Materials for Electronic Packaging: Volume 2, Thermal and Mechanical Behavior and Modeling, edited by M. Schen, H. Abe, and E. Suhir, American Society of Mechanical Engineers, AMD-Vol,1994, p.41-49 |
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