|
To purchase MEMS-related materials, supplies, equipment, wafers, etc.,
please visit the links section of the MEMSNet site.
| Property | Value | Conditions | Reference |
|---|
| Stress | -130 MPa | Temp=420 C,Nf=1.455,thickness=1um ,used in CMOS circuitry, BHF etch rate=4070(A/min),EDP etch rate=485(A/hr) | Solid-State Sensors and Actuators Workshop,Hilton Head Island, South Carolina,June 1994, p.31 |
|
MEMS and Nanotechnology Clearinghouse
