Material: Molybdenum (Mo), bulk

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Property↑↓	Value↑↓	Conditions↑↓	Reference↑↓
Density	10300 kg/m^3	Used in silicon integrated circuits.	Proceedings of IEEE,Vol 70,No.5,May 1982, p.421
Hardness,Knoop(KH)	275 kg/mm/mm	Used in silicon integrated circuits.	Proceedings of IEEE,Vol 70,No.5,May 1982, p.421
Specific heat	233.662 J/kg/K	At Temp=25 C.	CRC Materials Science and Engineering Handbook, p.260
Thermal conductivity	138 W/m/K	Used in silicon integrated circuits.	Proceedings of IEEE,Vol 70,No.5,May 1982, p.421
Thermal conductivity	138 W/m/K	Value at temp=300 K.	CRC Materials Science and Engineering Handbook, p.270-274
Yield strength	2.1 GPa	Used in silicon integrated circuits.	Proceedings of IEEE,Vol 70,No.5,May 1982, p.421
Young's Modulus	343 GPa	Used in silicon integrated circuits.	Proceedings of IEEE,Vol 70,No.5,May 1982, p.421