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To purchase MEMS-related materials, supplies, equipment, wafers, etc.,
please visit the links section of the MEMSNet site.
| Property | Value | Conditions | Reference |
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| Density | 10300 kg/m^3 | Used in silicon integrated circuits. | Proceedings of IEEE,Vol 70,No.5,May 1982, p.421 | | Hardness,Knoop(KH) | 275 kg/mm/mm | Used in silicon integrated circuits. | Proceedings of IEEE,Vol 70,No.5,May 1982, p.421 | | Specific heat | 233.662 J/kg/K | At Temp=25 C. | CRC Materials Science and Engineering Handbook, p.260 | | Thermal conductivity | 138 W/m/K | Used in silicon integrated circuits. | Proceedings of IEEE,Vol 70,No.5,May 1982, p.421 | | Thermal conductivity | 138 W/m/K | Value at temp=300 K. | CRC Materials Science and Engineering Handbook, p.270-274 | | Yield strength | 2.1 GPa | Used in silicon integrated circuits. | Proceedings of IEEE,Vol 70,No.5,May 1982, p.421 | | Young's Modulus | 343 GPa | Used in silicon integrated circuits. | Proceedings of IEEE,Vol 70,No.5,May 1982, p.421 |
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