|
To purchase MEMS-related materials, supplies, equipment, wafers, etc.,
please visit the links section of the MEMSNet site.
| Property | Value | Conditions | Reference |
|---|
| Modulus of Rupture | 0.4638 GPa | Ceramic,sintered,at temp=980 C | CRC Materials Science and Engineering Handbook, p.536 | | Modulus of Rupture | 0.5931 GPa | Ceramic,sintered,at temp=1090 C | CRC Materials Science and Engineering Handbook, p.536 | | Modulus of Rupture | 0.2483 .. 0.3931 GPa | Ceramic,hot pressed,at room temperature | CRC Materials Science and Engineering Handbook, p.536 | | Modulus of Rupture | 0.49655 GPa | Ceramic,hot pressed,at temp=1090 C | CRC Materials Science and Engineering Handbook, p.536 | | Modulus of Rupture | 0.3793 GPa | Ceramic,hot pressed,at temp=1200 C | CRC Materials Science and Engineering Handbook, p.536 |
|
MEMS and Nanotechnology Clearinghouse
