I know that this forum is for non commercial MEMS related discussions and I
participate as much as I can to help the community but I have the following
question to ask.

I would like to know if there is a demand for a variety of wafer processing
steps that could be run in our new fabrication facility. We currently can offer
Evaporation,Photolithography, Stack Etch, Deep Silicon Etch, oxide and nitride
etch, Aluminum and GaAs etch, Sputtering DC magnetron of variety of metals,
PECVD low temperature oxide and nitride, and Gold plating.

The advantages are that we can run a number of processes at one time to
eliminate or reduce the shipping of wafers from foundry to foundry. I would like
to gauge the interest to see if it would be feasible to offer these services now
or in the near future. Thanks

Bob Henderson
Process Integration,LLC
1025 S. 52nd Street
Tempe, Arizona 85281
Phone: 480-968-8818 x 11
Fax: 480-968-8896