Hi all,
I was doing gold electroplating using cynide bath.I
was doing plating on Si wafer sputtered with gold
later covered with photoresist ,exposed and developed
and hardbaked.
after doing the above i have tried AU electroplating.I
was going for very low current densities and very low
temperature and with optimum PH after very less time i
could obsevere the plating of gold but the Photoresist
is disturbed and the pattern was disturbed.
Can i find any ways to improve adhesion of photoresist
on AU surface.
Ur suggestions are highly appreciated.
Thanks
Kris
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