Hi all,

I was doing gold electroplating using cynide bath.I
was doing plating on Si wafer sputtered with gold
later covered with photoresist ,exposed and developed
and hardbaked.

after doing the above i have tried AU electroplating.I
was  going for very low current densities and very low
temperature and with optimum PH after very less time i
could obsevere the plating of gold but the Photoresist
is disturbed and the pattern was disturbed.

Can i find any ways to improve adhesion of photoresist
on AU surface.

Ur suggestions are highly appreciated.

Thanks
Kris


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