Jim,
    Is the HMDS prime vacuum vapor prime.  The vacuum dehydration removes
moisture, HMDS reacts with moisture leaving molecular sights that can lift
causing poor adhesion.  Bill Moffat

-----Original Message-----
From: Jim Beall [mailto:beall@boulder.nist.gov]
Sent: Tuesday, May 13, 2003 1:50 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] photoresist adhesion to Tungsten


Dear All -

A colleague is using photoresist and a hydrogen peroxide wet etch to
pattern 200 nm thick W films. He is having adhesion problems for
etches longer than 30 seconds (large areas of PR peel off). He has
tried HMDS prime, 120 C post bake, etc. The post bake helped a
little, but he needs a more durable coat.

Does anyone have any lore for increasing PR adhesion to W in  a
hydrogen eroxide etch?

Thanks,

Jim
--

  - Jim Beall 303-497-5989
    beall@boulder.nist.gov


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