Hi,
Device curling is buckling due to heating temperature. When you bond your
die on PCB, you can try some UV or room temperature curing epoxy. This can
avoid temperature problem you met.
good luck!
Dlee
mechanical engineering Department
UT at Austin
>From: mems-talk-request@memsnet.org
>Reply-To: mems-talk@memsnet.org
>To: mems-talk@memsnet.org
>Subject: MEMS-talk Digest, Vol 7, Issue 4
>Date: Tue, 06 May 2003 09:46:10 -0400
>
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>Today's Topics:
>
> 1. thermal effect on MUMPS (weiwei2)
> 2. Re: Photoresist for Au etching (BobHendu@aol.com)
> 3. PZT patterning (Vittal Sai.P.S)
> 4. RE: Borosilicate Glass Holes (Jon Hiller)
> 5. Flaws size in cracked glass. (pik)
> 6. RE: Quartz or silicon wafer with a poly-silicon layer
> (Ravi Mullapudi)
> 7. Process for Pt1000 (Seong-Gi Baek)
> 8. Piezoresistive coefficients of PZT4 mebrane (Sriram Akella)
> 9. Re: Borosilicate Glass Holes (Henry Helvajian)
> 10. How to etch Cr with Au & Ni electroplating and etching (Chen Yan)
> 11. electro and electroless plating for Ni? (Chen Yan)
> 12. RE: Anisotropic Cu Wet etching (HE,Han-Johnny)
> 13. RE: thermal effect on MUMPS (Cain, Mike)
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