Hi all,

I am currently fabricating surface micromachined diaphragms, the sacrificial
layer of which will be removed by etching through lateral channels at the
side of the diaphragm. I'd like to subsequently seal the channels with a
CMOS-compatible material, but the channel height is approximately 1.5-2
microns.

Does anybody know how easy or difficult this will be?
Is there a deposition simulator out there than I can use to predict the
thickness of the sealing material needed?
Anybody have any idea as to what is the best material to use in this
situation?

Thanks in advance,

Conor.

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Conor O'Mahony
National Microelectronics Research Centre(NMRC),
Lee Maltings, Prospect Row, Cork, Ireland.
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