If you are planning on attending SemiconWest in San Jose next week, I would like
to invite you to attend a meeting of the MEMS Packaging Standards Working Group
of SEMI's new International MEMS Standards Group.

This informal meeting will be held on Wednesday, July 16th from 1 PM to 3 PM in
Conference Room "E" of the San Jose Convention Center.

The goal of the meeting is to identify and prioritize areas where the
development of standards can be of assistance to those involved in the packaging
of MEMS devices.

We are particularly interested in hearing from end users who are being hindered
by the absence of packaging standards as they attempt to initiate or ramp up
production of MEMS devices.  We are also eager to hear from equipment
manufacturers who are being frustrated by managing the interfaces between
suppliers to the final assembly, packaging and test areas.

Initial areas of interest include hermeticity, marking, reliability, package
dimensions and thermal characteristic specifications.  Please come and add your
area of concern to this list.

Please contact me directly with any questions, comments or input to this effort.
I can be reached by phone at 603-627-8484 ext. 141 or by e-mail at
[email protected].

Thank you.  I look forward to seeing you in San Jose!

Sincerely,
Charlie Cuneo
Chairman, MEMS Packaging Standards Working Group
SEMI International MEMS Standards Group