For evaporated copper in 5:1 BHF, we measured an etch rate of less than 5
nm/min,
with the the surface being slightly roughened.
    --Kirt Williams, Ph.D.    consultant

----- Original Message -----
From: Frank Rasmussen 
To: 
Sent: Tuesday, July 29, 2003 8:05 AM
Subject: [mems-talk] Etch rate of Cu in BHF


> Hi,
>
> Does anyone know the (approximate) etch rate of Cu in BHF ?
>
> I am using BHF to remove a copper oxide layer generated on my structures
during processing. I expect the Cu etch rate to be very small, though I
would like to have this confirmed.
>
> The Cu on my wafers have been deposited by means of MOCVD. Perhaps this is
relevant to the question above ?
>
> Thanks,
> Frank
>
> __________________
> Frank Engel Rasmussen
> Industrial PhD Student
> MicroElectro-Mechanical Systems (MEMS) Group
>
> Mikroelektronik Centret
> Technical University of Denmark
> Oersteds Plads, Bldg. 345-east
> DK-2800 Kgs. Lyngby, Denmark
>
> Tel. direct: +45 4525 6316
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> http://www.mic.dtu.dk
>
>
>


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