Contact Dr.Farrens @ EV Group, she can probably answer
most if not all of your questions on IR inspection and
bonding methods for MEMS.

602-437-9492 or 602-432-9406 cell

-----Original Message-----
From: Tom Molamphy [mailto:tom_molamphy@phoseon.com]
Sent: Thursday, August 07, 2003 8:46 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Market Size for different Wafer Bonding Methods?


Hi All,

Any idea on where I might find market data for use of different wafer
bonding methods for MEMS? Any opinions on likely winners in this technology
moving forward?

Thanks,

Tom

________________________________________________

Tom Molamphy

Phoseon Technology

Office: 970 266 8097

Cell: 970 443 1864

Fax: 970 267 0801

www.phoseon.com







_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/