A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: electroforming of copper
electroforming of copper
2003-08-19
kin@astri.org
2003-08-19
ikadija@fibrotools.com
processing procedure of AZN 4035
2003-08-19
Jianzhong Zhu
electroforming of copper
ikadija@fibrotools.com
2003-08-19
Hi Kin,

You should be able to electroplate 300 micron copper from almost any
electroplating solution with an appropriate electroplating equipment. All
electroplating processes require careful control of transport of matter as
well as electric field distribution. Also, the process may take from few
hours to over one day depending on the type of equipment used. You may
formulate your own standard electroplating solution or obtain one of
commercial formulations by Technic, Shipley, MacDermid, Cookson Electronics
(Enthone) and others. They will also provide plating instructions. You can
contact me directly at 201/670-8397 or by e-mail at ikadija@fibrotools.com
for more
information.

I. Kadija
President, ECSI


----- Original Message -----
From: 
To: 
Sent: Tuesday, August 19, 2003 4:00 AM
Subject: [mems-talk] electroforming of copper


> Hi all,
>
>     I am going to do electroforming of copper. The thickness
> is about 300um. I would like to ask any vendor is selling
> that electroplating bath which is suitable for this bulk
> electroplating purpose? Anyone has the experience of
> electroforming?
>
> Best Regards,
> Kin
>
>
> _______________________________________________
> MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/
>




reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
University Wafer
Mentor Graphics Corporation
Harrick Plasma, Inc.
Process Variations in Microsystems Manufacturing