Hi,
At Heriot-Watt university, we have plated gold onto Si,glass and SiO2
wafer, I think it is not necessary to plate Ni before plating gold unless
you are using Cu or Ti as seedlayer/structure. If you wants only gold
alone, you can try and deposit very thin layer of Cr/Au as seedlayer to
your wafer using E-beam or Sputtering. Sputtering will be better for SIO2
wafer. For Si/glass wafer, e-beam or sputtering will be fine. As for
electroless gold plating, I think the growth rate for AU is very slow,
therefore if you needs only a very thin layer (less than or 1um) of AU, it
will be alright to use electroless AU plating. If you need a thick layer of
gold maybe a few to tenth of micros, I would recommend electro-plating. I
think it is not very difficult to use. you just have to buy the Au
solution, maybe 4L for 3" wafer technology.
We used the ECF pure Au Process from Metalor, ECF 60.
what you need:-
3L beaker
power supply up to 1mA resolution.
pltinised Ti gus as Anode
hot-plate with magnetic stirrer
wafer holder (self-made) to hold wafer as cathode
temperature for plating is 46-50 deg
currently density 0.3 A/dm2
PH : 8.5 - 10 best result at 9-9.5
growth rate of Au: up to 10um per hour! with opitum plating parameters.
We are able make the Au plating system for you if need.
feel free to contact me!
email: [email protected]
tel:- 44-7759528616
Best of luck for your project!
AJ Pang
On Mon, 25 Aug 2003 14:07:31 -0400, transene
wrote:
> Dear Ah,
>
> It is necessary first to deposit nickel onto your glass substrate.
> Bright Electroless Gold will deposit onto the nickel. Transene
> Company
> (www.transene.com) offers products suitable for nickel and gold
> plating.
> Or, feel free to contact me directly.
>
> Christopher Christuk
> Transene Company
> Tel: 978 777 7860
> Email: [email protected]
>
> -----Original Message-----
> From: Ah Gong [mailto:[email protected]]
> Sent: Sunday, August 24, 2003 6:10 AM
> To: General MEMS discussion
> Subject: Re: [mems-talk] How to deposit gold onto a silicon dioxide
> or
> ontoaluminium
>
> but i dont have PLD in my clean room just E-beam
> evaporator but the system is down i need to fabricate
> my wafer urgently so does electroless gold able to
> deposit gold onto my wafer????
> --- Ganesh Kumara wrote:
> > You can try to deposite gold on SiO2 using Pulsed
> > Laser Deposition(PLD)
> > technique. PLD deposition of gold is the most
> > adhesive to SiO2 as per my
> > experience.
> >
> >
> > >From: Ah Gong
> > >Reply-To: General MEMS discussion
> >
> > >To: [email protected]
> > >Subject: [mems-talk] How to deposit gold onto a
> > silicon dioxide or onto
> > >aluminium
> > >Date: Thu, 21 Aug 2003 09:01:49 +0800 (CST)
> > >
> > >Is it possible to deposit gold onto a silicon
> > dioxide
> > >or aluminium layer using bright electroless gold
> > >solution as i had been trying to do so but to no
> > avail
> > >maybe someone can recommend me the best way to
> > deposit
> > >gold onto the wafer to do MEM switches or better
> > using
> > >the elctroless gold solution which i had bought
> > >
> > >=====
> > >
> > >
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