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MEMSnet Home: MEMS-Talk: Wanted Adhesive for Bonding
Wanted Adhesive for Bonding
2003-09-23
Michaela Wullinger
2003-09-24
BRAD JOHNSON
Wanted Adhesive for Bonding
BRAD JOHNSON
2003-09-24
Hello Michaela,
Suss MicroTec has several papers for bonding different adhesives such as BCB,
SU-8 and many others.  Your questions is quite broad.  If you can give me more
info on what your goals are I can forward some papers and even a recipe you can
run on the SB6 you have there.

Brad Johnson
Suss MicroTec
Applications Engineer
1-800-685-7877 Ext119
bjohnson@suss.com

>>> wulling@ipms.fraunhofer.de 09/23/03 12:13PM >>>
hi all,
we are testing resists for adhesiving bonding.
The intermediate layer has to be less than 1 µm.

Is somebody using a resist for bonding? We want to test a few.

regards
Michaela




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