Hey Ravindra,

  A copper seed layer works best, however copper doesn't stick to your
substrate too well. Therefore you need a layer of titanium before. Sputter
around 50nm of titanium and 200nm of copper. Also make sure you start your
electroplating as soon as possible after sputtering or the copper may be
oxidized and become less conductive. However, you can always protect it with
another film of titanium and then etch out the titanium before you start
electroplating.

  The best solution you can use is nickel sulphamate. You can easily get its
recipe on the Internet.

   Regards
Sreeram Appasamy
-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of
ravindra mukhiya
Sent: Wednesday, September 24, 2003 4:36 AM
To: [email protected]
Subject: [mems-talk] electroforming (Ni)


hi experts,
i am member of this group and PG student in india.
i am doing Ni electroplating first time.
if anyone have any experience please suggest me
which metal should sputter ( Cu, Au, Cr)for
su-8 resis mold and which plating solution and
condition would be best.

thanks a lot.

RAvindra Mukhiya
M. Tech. Student
India.
Email: [email protected]
        [email protected].


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