Hello,

I need to do Au-Au thermal compression bond using Karl Suss bonder.
Sometimes the bonding is not uniform across the wafer.  I understand that it
could have been caused by particles on the wafer or film uniformity, etc.
My question is:

Is there a requirement for wafer flatness (TTV less than ?? um) in order to
achieve a uniform bond.  Any comments and suggestions are appreciated.

Melvin

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