Hey Ashari
Aluminum is soluble in both acidic and basic solutions and is not an
ideal seed layer. The typical seed layer used for electroplating is titanium
followed by copper.
Regards
Sreeram
-----Original Message-----
From: mems-talk-bounces+sappasam=ececs.uc.edu@memsnet.org
[mailto:mems-talk-bounces+sappasam=ececs.uc.edu@memsnet.org] Sent: Tuesday,
December 16, 2003 2:59 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] seed layer for nickel elctroplating
Is there a way to electroplate nickel onto aluminium
coated wafer as im unable to do so currently. Whats
the best seed layer for nickel electroplating.
=====
ashari keling
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