Melissa,
Please feel free to contact the process team at STS, they can discuss
process conditions with you and how all factors of the process can achieve
different results.
You can contact them at lilian.atabo@stsystems.co.uk or
huma.ashraf@stsystems.co.uk
Best Regards
Andrew
------------------------------
Message: 13
Date: Tue, 13 Jan 2004 14:29:15 +0800
From: tailing@dso.org.sg
Subject: [mems-talk] APC angle in ICP process
To: General MEMS discussion
Message-ID: <1073975355.4003903b2e65b@webmail.dso.org.sg>
Content-Type: text/plain; charset=ISO-8859-1
Hi,
Am using an STS ICP Deep Reactive Ion Etcher. Have noticed that the APC
angle
is slightly different in different protocols and this seems to affect the
etch
outcome. Could I ask what is APC angle and how does it affect etch profile
and
speed. Thanks.
Regards,
Melissa
------------------------------
_______________________________________________
MEMS-talk mailing list
MEMS-talk@memsnet.org
http://mail.mems-exchange.org/mailman/listinfo/mems-talk
End of MEMS-talk Digest, Vol 15, Issue 12
*****************************************