I found a photoresist liftoff process worked well with e-beam evaporated
films < 0.5um thick. This was on glass - the surface had to be silanised
first to get reasonable adhesion for the film. It was still a very fragile
layer, though.
Jonathan
-----Original Message-----
From: FENG Chun Hua [mailto:allenfch@ust.hk]
Sent: 26 January 2004 03:27
To: mems-talk@memsnet.org
Subject: [mems-talk] Patterning Teflon
Dear all,
May somebody have experience of patterning an dielectric layer like
Teflon AF? Your kind help will be greatly appreciated.
Regards
Allen
_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/