Hello All,
This is Tetsuya Kishino with Kyocera corporation, Japan.
I'm trying to fabricate a metal post on a Si substarte. The dimensions of the
post should be 100 microns in diameter
and 300 microns in height. I'm thinking of some techniques such as electro-
plating with solder resists, solder-filling,
or multi-layer Au bump...
However, I'm doubting these techniques because the post may be too high and the
aspect ration may be too large.
Is anyone know:
- a solder resist for 300 microns in thickness?
- whether we can fill the hole of 100 microns in diameter and 300 microns deep
by solder-printing?
- materials suitable for the metal post?
- or any idea to fabricate the metal post?
Any advice or suggestion will be welcome.
Thanks
Tetsuya Kishino
Kyocera corporation, Japan