Jin Jiandong,
Gold bonding can indeed be used for a strong wafer-level bond. A lot of good
information on this process has come out of MIT. One paper is "Wafer-Level
Thermocompression Bonds" by Tsau, Schmidt, and Spearing at MIT, from Advanced
Materials for Micro- and Nano-Systems (AMMNS), Jan 2003. Wafer preparation,
process, and equipment are discussed.
Best Regards,
Chad Brubaker
EV Group invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
C.Brubaker@EVGroup.com, www.EVGroup.com
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-----Original Message-----
From: mems-talk-bounces+c.brubaker=evgroup.com@memsnet.org [mailto:mems-talk-
bounces+c.brubaker=evgroup.com@memsnet.org] On Behalf Of jane jin
Sent: Tuesday, March 02, 2004 12:57 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Au-Au bonding
Hello, list members
I am trying to bond three wafers together, and want to know if Au-Au can be
boned tightly, if it works , what is the principle, and in what condition it
will be bonded.
Thanks for any related answers.
Jin, Jiandong
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