Bill,
Try platinum (you may want to use titanium and/or chrome as
adhesion layers first).
marc
--
Marc Straub
Sr. Engineer, Solidus Technologies, Inc.
Colorado Springs, CO
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On Tue Mar 2 15:43:47 EST 2004 William Lanford-Crick wrote:
Hi group,
I need a conductive barrier metal to prevent Gold from
diffusing into ohmic metal after 850deg C annealing.
50 nm Moly is OK. Surface morphology is still somewhat
rough after annealing. Any ideas of what might be better?
-Bill