Hi all,
does any of you have any experience with using Ir (Iridium) as an adhesion for
for sputtered Cu. I know that most people use Cr, Ti. Are there any alternatives
?
Thanks
Dipankar
---
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--------- Original Message ---------
DATE: Fri, 18 Jun 2004 10:57:57
From: "Dipankar Ghosh"
To: "General MEMS discussion"
Cc:
>Hi all,
>
> I am trying to sputter thick Cu ( 1 um) in a DC sputtering system.my
sputtering conditions are as follows :-
>
>base pr- 10 exp(-6) torr
>
>chamber pr -10 m torr
>
>Ar gas flow - 10 sccm.
>
>power - 250 W
>
>Target to substrate distance - 5 cm.
>
>my problem is that the resistivity of my deposited Cu is very high (24 micro
ohm cm) which is about 15 times the bulk resistivity of Cu( 1.6 micro ohm cm).
>
>does anybody any any experience with deposition of thick Cu with low
resistivity values.pls let me know.
> Thanks in advance,
> Dipankar
>
>OFFICE ADDRESS :-
>
>MATERIALS RESEARCH CENTER,
>ROOM 322 , RB-1,
>1001 CAPABILITY DRIVE,
>CENTENNIAL CAMPUS, NCSU,
>RALEIGH ,
>NC 27695-7919
>USA
>
>PH- 919 515 5049
>FAX- 919 515 3419
>
>
>
>
>
>
>
>
>
>
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