Dear MEMS colleagues,
I have problems to make small vias (<10um) in BCB
layer (5um thick). Originally I want to use
photosensitive BCB 4024-40, but the sidewall is quite
oblique, and even when the via is as large as 20um,
the lithography result is still not good. So, now I
want to try an alternative: coating of the same BCB,
hard cured, patterning the soft mask (AZ4620
photoresist) or hard mask (metal or oxide), and then
plasma etching of the hard cured BCB. I'm not sure it
this process is able to make the small vias. Anyone
can share similar experience with me?
By the way, there is a paper on soft mask for the
above process:
Michelle. J. Berry, P. Garrou, Boyd Rogers, Iwona
Turlik. "Soft Mask for Via Patterning in BCB
Dielectric" Int. J. Microcircuits & Electronic
Packaging, Vol. 17, 1994, p. 210
Unfortunately I can't find the volume of this journal
in our library. Anyone can kindly provide a soft copy
of this paper? Thanks a lot.
Best regards,
Ebin
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