Au plating - excessive bubble formation at cathode
Michael L
2004-12-13
Hi Everyone,
I am using Engold 2010C (VR) to deposit hard Au layers, however, I seem to
get persistent bubble formation over the seed layer as soon as the current
is applied. The bubbles cover the entire seed layer to such an extent that
no metal is deposited.
Has anyone experienced similar problems with Au plating solutions -
particularly those based on cyanide?
Regards,
Michael