I am looking for a foundry that can place a patterned metal of at least
100µm thickness onto a 4-inch wafer. Some options for this would be direct
electroplating, or bonding patterned metal to the wafer. The pattern would
be a grid of 170µm holes on 340µm pitch. Metals can be gold or molybdenum
or anything with a reasonable thermal match to GaAs.
Any assistance would be greatly appreciated.
Brad Cantos
Dir. Wafer and Die Operations
Novalux, Inc.