How to do the lift off process after
aluminumdeposition? It is negative resist.
Duan
2005-03-31
Hi all,
Thanks for your help.
For me, what I have done is
I had a 6'' silicon wafer and I coated it with negative photo resist
(Arch Chemicals HNR80), 1 micron in thickness, I think. It was
exposed under UV light, and then developed. After this, I evaporated
a thin aluminum film onto the wafer, one micron thick. Then I need to
do the lift off process to pattern the aluminum. However, I got
failed in doing so. It seems like that, the acetone can not etch the
negative PR, which works well in removing positive PR.
So I need to figure out another way or find out another solvent to do
this. Could you give me some suggestion?
Thanks very much.
Duan