I am looking for some advice on removing thin metal layers used as an
underbump metal layer in solder bump deposition. My underbump metal
composition is:
400A Ti
500A Cu
400A Au
My bumps are PbSn solder. Obviously, I want to minimize undercutting
the bumps, as well as minimize attack to the solder itself.
Hope someone can help! Regards,
Keith McConnell
Children's Hospital Med Ctr
Cincinnati, OH