Thin (~20nm) Cr or Ti film will be helpful. Also, plasma clean the substrate
before your deposition.

Good luck,

Hongjun

-------------------------------------
Hongjun Zeng, PhD
MEMS/Nano Scientist
Nanotechnology Core Facility (NCF)
University of Illinois at Chicago

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of sc wang
Sent: Tuesday, October 11, 2005 11:46 PM
To: [email protected]
Subject: [mems-talk] Ni /Au adhesion

HI.

I have tried depositing Ni/Au(E-GUN) on bonding pad, but got poor adhesion.
(Ni=500A, Au=5000A)
So far, I tried Ni-Silide to improve the adhesion, but still can't work.
Is there any idea can improve Ni/Au adhesion?