I've been using a TC Bond recipe that runs over 8 hours. I'm sure a
much shorter time would suffice. For padding I use 0.5 mm flexible
graphite from Goodfellow. You may be able to reduce the bond pressure
if the temperature is increased.
Roger Shile
-----Original Message-----
Subject: Re: [mems-talk] Au/Au thermocompression
Thanks Roger,
an additional information:
for how long you kept your samples in your machine? The temperature =20
you chose looks preaty low.
One more thing: what would you suggest as soft material (Al foil =20
perhaps?).
Lorenzo