Hi,
I am trying to pattern gold metal lines (100microns width) via lift-off using
AZ9260 resist. The gold thickness is about 600nm. After spiining the AZ9260 at
about 2400rpm for 60s, I discovered that the resist is about 7-8micorns thick,
which is sufficiently thick for the lift-off process.
May I know which developer is recommended? I use AZ400K Developer :DI water in
the ration of 1:4 for 8-9 mins and found that this works but the timing is very
critical because a shorter time results in resist remaining and a longer time
than this causes my patterns to be lifted off in the development process.
Any comments are appreciated.
Jeffrey