Hello,
my name is Denis.
I am a Ph.D. student for IMSAS Uni Bremen.
I am going to try an electroplating process (approx. 10 µm of Ni) on a
ceramic substrate named above.
Has anybody done something like that?
I am going to sputter a seed layer of Cr-Au before electroplating
(plus approx. 100 nm of Cu as a sacrificial layer for my future
freestanding Ni structures).
I have already successfully produced electroplated prestressed
Ni-structures on Si-substrates.
Is there anything I should specially conceard during the
electroplating on a caramic substrate?
Thanks in advance!
--
Denis Petrov
Ph.D. Student
Institute for Microsensors, -actuators and –systems (IMSAS)
University of Bremen
http://www.imsas.uni-bremen.de