Hi all,
and thanks in advance for the suggestions...do you think that is possible to
bypass the problem making the Post bake in a vacuum oven in order to
eliminate the outgassing of the uncrosslinked SU-8?What do you if instead
of Cr i try to deposit the Ti?
Andrea Lucibello
----- Original Message -----
From: "Aniruddh Sarkar"
To:
Sent: Wednesday, March 18, 2009 1:55 AM
Subject: Re: [mems-talk] Uncured SU-8 crack
Hi,
I have tried this before and though I did not finally get it to work (found
a way to bypass this step) but I remember seeing a reference (sorry not able
to find it now) that claimed this problem was because of a thermal expansion
coefficient mismatch. They put the wafer on a thermoelectric cooler and held
the temperature constant during the deposition and it worked just fine!
I am not sure whether its worth the effort of fitting the TEC inside the
vacuum system - but for what its worth this is what I remember reading.
--
Good luck,
Aniruddh