Hello,
I am looking for a solution to make metallised vias (approx. 100 µm in
diameter) through a 500 µm thick 4-inch ceramic wafer.
The surface must then be planarized to be used in subsequent MEMS-processing
steps. So, it must be a kind of a PCB on ceramics.
Does anybody know a vendor or maybe a process for that.
I would also be greatful in any information on how to efficiently create
such vias in silicon.
Thanks in advance!
Regards,
--
Denis