Are you using an adhesion layer such as Chrome or Titanium. You may want to
deposit a thin layer (10 - 20 nm) before Ni deposition. I know this helps
with thermal and e-beam evaporation but I am not sure that it will help for
your plating method.
On Thu, Jun 11, 2009 at 12:32 PM, Vikrant A. Chaudhari
wrote:
> dear friends,
>
> we are trying to plate Ni (electroless) on n-type Si wafer, we do observe
> Ni deposition but there are adhesion issues on as deposited samples and
> some times poor ahesion on annealed samples. Has anyone had a similar
> problem....? if yes what was the solution...
>
> thank you
>
> Vikrant A. Chaudhari
--
EVELYN BENABE
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