Hi everyone,
The process flow is :
1) Si ,DRIE
2) Spincoat AZ5214E ,fill the trench completely then expose and develop
remove the suface PR , remain the bottom PR in the trench
3) Anodic bonding with 7740 Glass
4) thinning
Could the remained PR influence the anodic bonding process during 400degree C?
Thanks ,
--
Yan Xin
-Pen-Tung Sah MEMS Research Center,
-Xiamen University, CHINA
XMU HOME:
http://memsc.xmu.edu.cn/mems_renchaiduiwu/XuYuan_Chen-Group/index_1.html