I am using SU-8 (2150), a negative photo resist for ultra thickness.
But during development it takes lot of time, likely 24 hour. May i know the
procedure how to develop to it as conventional ways. How do i striping out
SU- 8, with out affecting metal part of substrate.(I mean with out
introducing piranha cleaning).
With Best Regard,
CeNSE, IISc, Bangalore (India)
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org
Want to advertise to this community? See http://www.memsnet.org