Dear Hong,
if you look for simple lab equipment you can get it from idonus in
Switzerland ( www.idonus.com ). Their specialties are custom made
solutions.
Best regards
Christian
On 22.05.2013 20:55, Hong Wang wrote:
> Dear All,
> We start working on lithography and bonding process using 170 um thin
> fused silica for microfluidic devices. We always got broken wafers.
> We are looking for materials and techniques for supporting the thin wafer.
> The support wafer should be easily removed after the device is assembled.
> Any input will be appreciated.
> Hong
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_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org
Want to advertise to this community? See http://www.memsnet.org
To unsubscribe:
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