We have a DRIE machine with electrostatic chuck for silicon etching.
After double- side-etching of SOI wafers with very delicate structures, we are
facing a problem of stiction to the chuck: when lifting the wafer from the
chuck, some of the dies break off the wafer and remain stuck to the chuck.
This is not due to organic residues on the back side of the wafer, as we descum
this side before etching the front side.
If anyone has ideas how to avoid this, please let us know.
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