I am defining now a scrubber machine to be used in my process.
The purpose of the machine is to do surface preparation to the wafer before
it enters the line.
What is the standard mechanical method for scrubbing? Is it a rotating
brush pressured on a spinning wafer or a disc brush in the diameter of the
wafer pressured from above the wafer as in CMP processes? It seems to me
that with the second option (disc) it is easier to control the process on
the wafer and to ensure that every surface of the wafer receives the same
amount and pressure of scrubbing.
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