at first, I want you to understand that I don't know english very well.
I performed Cu deposition process(3000Å) for forming electrode(for
and I wil perform PR patterning on Cu layer and Ni electroplating.
I would like to know if Cu film can oxidize naturally after 1~2 days.
if Cu film oxidizes, it affects Ni electroplating??
ex) oxidized Cu layer can I no longer use for electrode for electroplating???
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