Hello All,
I've been trying some low budget Thermal Silicon Fusion Bonding with
limited success. I've done .3um SiO2 on both wafers, one wafer with
oxide/ one without, and both striped of any oxide. I've tried the wafers
wet, dry, with a weight and without. Always ramping up to 1100C at
10C/min in a tube furnace, with the wafer in at 1100C for 5hrs.
My best method has been one wafer with oxide and one without, stuck
together with water. I got about 50% bonded.
Any help would be appreciated.
Thanks,
(microfab junkie)
Mark Crain
Research Assistant
University of Louisville
mmcrai01@starbase.spd.louisville.edu
(microfab junkie)