Have you investigated the usage of an FIB (Focused Ion Beam) system
instead??
Best regards,
Steve Rosenberg
Deschutes Corporation
17400 SW Upper Boones Ferry Rd #240
Durham OR 97224
(503) 443-3602 Fax: (503) 443-2353 Mobile: (503) 312-4647
Email: sar@coho.net
-----Original Message-----
From: Thomas Ammer
To: MEMS@ISI.EDU
Date: Friday, February 05, 1999 12:34 PM
Subject: direct lasert writing in thick resist
>Dear Colleagues,
>
>I am trying to fabricate 3D structures in thick positive photo resist
>(20-50 micron) by direct laser writing with a blue laser (440nm).
>Does anybody have experience, which type of resist is best suitable for
>this purpose?
>At the moment I am using Microposit S1828. It has good properties for
>thin films, but exceeding 10 micron, the softbake procedure seems to be
>too critical.
>The very surface layer is almost development-inhibiting, which results
>in a very inhomogenous development for shallow structures.
>Unfortunately, most thick film resist are optimized for high contrast
>and aspect ratios, which is disadvantegous if you want to obtain
>arbitrary depths.
>
>Thank you and with best regards, Thomas Ammer.
>
>
>Thomas Ammer
>CSEM Micro-Optics
>Badener Str. 569
>8048 Zurich
>Switzerland
>Tel: +41 1497 1434
>thomas.ammer@csem.ch
>
>
>
>
>
>