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>AZ 4620 is regularly used for Cu and Au plating in 25 micron application.
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I have tried AZ4620 with a basic (pH 10) gold sulfite solution. The resist
is attacked by the high pH solution. If you plan to use AZ4620, I recomend
plating at a slightly lower pH... 8.5 or so. AZ4620 can be easily removed
using a solvent or even full strength developing solution.
Regards,
Yohannes